Home page

Component High and Low Temperature Testing

Summary Introduction

In the electronics industry, the temperature rise of a device must be strictly controlled because temperature has a large impact on the performance of components. But the temperature is too high or too low will lead to device failure. In practice, we often encounter such problems: a component in a certain ambient temperature work normally, but to another environment is abnormal; the same batch of the same type of product in different environments when used in its performance is not the same. The reason for this is because of the impact of environmental factors. Therefore, the electronic and electrical products for artificial simulation of environmental testing is to ensure its production, transport, use and other aspects of safety and reliability. High and low temperature integrated machine is widely used in high and low temperature testing of components, can be used for environmental testing of components and simulation testing of electronic components. In semiconductor production and electronic device testing, there are many processes that require precise temperature control, and the integrated heating, cooling and temperature control machine can be used for high and low temperature control testing.

Detailed introduction

High and low temperature test is mainly for electrical and electronic products, as well as its original devices, and other materials in the high temperature, low temperature environment, storage, transport, use of adaptability test. Test equipment is mainly used for products in accordance with national standards or user-defined requirements, in low-temperature, high-temperature, under the conditions of the product's physical and other related characteristics of the environment simulation test, after the test, through the detection, to determine the performance of the product, whether it still meets the predetermined requirements for product design, improvement, identification and factory inspection. Through high-temperature aging can make the defects of components, welding and assembly and other hidden dangers that exist in the production process in advance of exposure, aging and then electrical parameter measurements, screening and elimination of failures or changes in the value of components, as far as possible, the early failure of the product eliminated in the normal use of the product before the factory to ensure that the product can withstand the test of time.

Now need electronic products are required to meet the humidity environment test, humidity test, generally in order to find out as early as possible in the design of the product whether there is a more fragile components, whether there is a process problem or failure mode, in order to provide the product quality design to improve the reference. In order to ensure product performance, a variety of temperature and humidity indicators and time intervals are used during testing, during which each stage of the test must be passed and meet the specifications.

Some materials that are prone to moisture absorption, such as printed circuit boards, plastic extrusions, packaging components, etc., will absorb moisture proportionally to the pressure and time of exposure to water vapour. When a material absorbs too much moisture, it can cause swelling or contamination and short-circuiting, and can even damage the product's functionality, e.g., by causing leakage currents in sensitive circuits that can cause the product to fail, or by chemical residues that can cause serious problems with circuit boards. Some chemical residues may even cause serious corrosion of the circuit board or oxidation of metal surfaces due to water vapour. In some cases, water vapour and voltage differences between neighbouring circuits can also cause the formation of dendritic filaments due to the electron migration effect, leading to product system instability and other problems.

These tests are carried out by high and low temperature machines to confirm the suitability of products for storage, transport and use in temperature and humidity climatic environments. The severity of the test depends on the high/low temperature, humidity and duration of exposure. Product quality problems caused by poor design, raw materials or process measures during manufacturing are summarised below:

The first is that the performance parameters of the product are not up to standard, and the product produced does not meet the requirements for use; the second is potential defects, which cannot be detected by general testing means, but need to be gradually exposed in the process of use, such as silicon wafer surface contamination, organisational instability, weld voids, poorly matched thermal resistance of the chip and the casing, and so on.

+86-400-088-3616

Headquarters Address: Yingyu Industrial Zone, Heluo Town, Gongyi City, Henan Province

Telephone:+86-18595861852

WeChat Public